? semiconductor components industries, llc, 2013 june, 2013 ? rev. 2 1 publication order number: mc74hc368a/d mc74hc368a hex 3-state inverting buffer with separate 2-bit and 4-bit sections high ? performance silicon ? gate cmos the mc74hc368a is identical in pinout to the ls368. the device inputs are compatible with standard cmos outputs; with pullup resistors, they are compatible with lsttl outputs. this device is arranged into 2 ? bit and 4 ? bit sections, each having its own active ? low output enable. when either of the enables is high, the affected buffer outputs are placed into high ? impedance states. the hc368a has inverting outputs. features ? output drive capability: 15 lsttl loads ? outputs directly interface to cmos, nmos, and ttl ? operating voltage range: 2 to 6 v ? low input current: 1 a ? high noise immunity characteristic of cmos devices ? these are pb ? free devices figure 1. logic diagram 3 5 7 9 11 13 2 4 6 10 12 14 output enable 1 output enable 2 pin 16 = v cc pin 8 = gnd y5 y4 y3 y2 y1 y0 a0 a1 a2 a3 a4 a5 1 15 http://onsemi.com marking diagrams soic ? 16 d suffix case 751b tssop ? 16 dt suffix case 948f 1 16 1 16 hc368ag awlyww hc 368a alyw 1 16 a = assembly location wl, l = wafer lot yy, y = year ww, w = work week g or = pb ? free package see detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. ordering information (note: microdot may be in either location) pin assignment 1 16 13 14 15 16 9 10 11 12 5 4 3 2 1 8 7 6 a4 y5 a5 output enable 2 v cc y3 a3 y4 a1 y0 a0 output enable 1 gnd y2 a2 y1 function table inputs output enable 1, enable 2 a y llh lhl hxz x = don?t care z = high ? impedance
mc74hc368a http://onsemi.com 2 maximum ratings symbol parameter value unit v cc dc supply voltage (referenced to gnd) ? 0.5 to + 7.0 v v in dc input voltage (referenced to gnd) ? 0.5 to v cc + 0.5 v v out dc output voltage (referenced to gnd) ? 0.5 to v cc + 0.5 v i in dc input current, per pin 20 ma i out dc output current, per pin 25 ma i cc dc supply current, v cc and gnd pins 50 ma p d power dissipation in still air, plastic dip? soic package? tssop package? 750 500 450 mw t stg storage temperature ? 65 to + 150 c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above the recomme nded operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. recommended operating conditions symbol parameter min max unit v cc dc supply voltage (referenced to gnd) 2.0 6.0 v v in , v out dc input voltage, output voltage (referenced to gnd) 0 v cc v t a operating temperature, all package types ? 55 +125 c t r , t f input rise and fall time v cc = 2.0 v (figure 2) v cc = 4.5 v v cc = 6.0 v 0 0 0 1000 500 400 ns this device contains protection circuitry to guard against damage due to high static voltages or electric fields. however, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high ? impedance cir- cuit. for proper operation, v in and v out should be constrained to the range gnd (v in or v out ) v cc . unused inputs must always be tied to an appropriate logic voltage level (e.g., either gnd or v cc ). unused outputs must be left open.
mc74hc368a http://onsemi.com 3 dc electrical characteristics (voltages referenced to gnd) symbol parameter test conditions v cc v guaranteed limit unit ? 55 to 25 c 85 c 125 c v ih minimum high ? level input voltage v out = 0.1 v |i out | 20 a 2.0 4.5 6.0 1.5 3.15 4.2 1.5 3.15 4.2 1.5 3.15 4.2 v v il maximum low ? level input voltage v out = v cc ? 0.1 v |i out | 20 a 2.0 4.5 6.0 0.3 0.9 1.2 0.3 0.9 1.2 0.3 0.9 1.2 v v oh minimum high ? level output voltage v in = v il |i out | 20 a 2.0 4.5 6.0 1.9 4.4 5.9 1.9 4.4 5.9 1.9 4.4 5.9 v v in = v il |i out | 6.0 ma |i out | 7.8 ma 4.5 6.0 3.98 5.48 3.84 5.34 3.70 5.20 v ol maximum low ? level output voltage v in = v ih |i out | 20 a 2.0 4.5 6.0 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 v v in = v ih |i out | 6.0 ma |i out | 7.8 ma 4.5 6.0 0.26 0.26 0.33 0.33 0.40 0.40 i in maximum input leakage current v in = v cc or gnd 6.0 0.1 1.0 1.0 a i oz maximum three ? state leakage current output in high ? impedance state v in = v il or v ih v out = v cc or gnd 6.0 0.5 5.0 10 a i cc maximum quiescent supply current (per package) v in = v cc or gnd i out = 0 a 6.0 8 80 160 a ac electrical characteristics (c l = 50 pf, input t r = t f = 6 ns) symbol parameter v cc v guaranteed limit unit ? 55 to 25 c 85 c 125 c t plh , t phl maximum propagation delay, input a to output y (figures 2 and 4) 2.0 4.5 6.0 95 19 16 120 24 20 145 29 25 ns t plz , t phz maximum propagation delay, output enable to output y (figures 3 and 5) 2.0 4.5 6.0 175 35 30 220 44 37 265 53 45 ns t pzl , t pzh maximum propagation delay, output enable to output y (figures 3 and 5) 2.0 4.5 6.0 190 38 32 240 48 41 285 57 48 ns t tlh , t thl maximum output transition time, any output (figures 2 and 4) 2.0 4.5 6.0 60 12 10 75 15 13 90 18 15 ns c in maximum input capacitance ? 10 10 10 pf c out maximum three ? state output capacitance (output in high ? impedance state ? 15 15 15 pf c pd power dissipation capacitance (per buffer)* typical @ 25 c, v cc = 5.0 v pf 40
mc74hc368a http://onsemi.com 4 switching waveforms v cc gnd t f t r input a output y 10% 50% 90% 10% 50% 90% t thl t phl t plh t tlh output enable output y output y 50% 50% 50% 90% 10% t pzl t plz t pzh t phz v cc gnd high impedance v ol v oh high impedance figure 2. figure 3. test circuits *includes all probe and jig capacitance c l * test point device under test output *includes all probe and jig capacitance c l * test point device under test output connect to v cc when testing t plz and t pzl . connect to gnd when testing t phz and t pzh . 1 k figure 4. figure 5. a output enable v cc to other buffers y figure 6. logic detail one of 6 buffers
mc74hc368a http://onsemi.com 5 ordering information device package shipping ? mc74hc368adg soic ? 16 (pb ? free) 48 units / rail MC74HC368ADR2G soic ? 16 (pb ? free) 2500 tape & reel mc74hc368adtg tssop ? 16 (pb ? free) 96 units / tube mc74hc368adtr2g tssop ? 16 (pb ? free) 2500 tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d.
mc74hc368a http://onsemi.com 6 package dimensions tssop ? 16 dt suffix case 948f ? 01 issue b ??? ??? ??? dim min max min max inches millimeters a 4.90 5.10 0.193 0.200 b 4.30 4.50 0.169 0.177 c ??? 1.20 ??? 0.047 d 0.05 0.15 0.002 0.006 f 0.50 0.75 0.020 0.030 g 0.65 bsc 0.026 bsc h 0.18 0.28 0.007 0.011 j 0.09 0.20 0.004 0.008 j1 0.09 0.16 0.004 0.006 k 0.19 0.30 0.007 0.012 k1 0.19 0.25 0.007 0.010 l 6.40 bsc 0.252 bsc m 0 8 0 8 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a does not include mold flash. protrusions or gate burrs. mold flash or gate burrs shall not exceed 0.15 (0.006) per side. 4. dimension b does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25 (0.010) per side. 5. dimension k does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the k dimension at maximum material condition. 6. terminal numbers are shown for reference only. 7. dimension a and b are to be determined at datum plane ? w ? . section n ? n seating plane ident. pin 1 1 8 16 9 detail e j j1 b c d a k k1 h g ? u ? s u 0.15 (0.006) t s u 0.15 (0.006) t s u m 0.10 (0.004) v s t 0.10 (0.004) ? t ? ? v ? ? w ? 0.25 (0.010) 16x ref k n n 7.06 16x 0.36 16x 1.26 0.65 dimensions: millimeters 1 pitch soldering footprint* *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d.
mc74hc368a http://onsemi.com 7 package dimensions soic ? 16 case 751b ? 05 issue k notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.127 (0.005) total in excess of the d dimension at maximum material condition. 18 16 9 seating plane f j m r x 45 g 8 pl p ? b ? ? a ? m 0.25 (0.010) b s ? t ? d k c 16 pl s b m 0.25 (0.010) a s t dim min max min max inches millimeters a 9.80 10.00 0.386 0.393 b 3.80 4.00 0.150 0.157 c 1.35 1.75 0.054 0.068 d 0.35 0.49 0.014 0.019 f 0.40 1.25 0.016 0.049 g 1.27 bsc 0.050 bsc j 0.19 0.25 0.008 0.009 k 0.10 0.25 0.004 0.009 m 0 7 0 7 p 5.80 6.20 0.229 0.244 r 0.25 0.50 0.010 0.019 6.40 16x 0.58 16x 1.12 1.27 dimensions: millimeters 1 pitch soldering footprint* 16 89 8x *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. on semiconductor and are registered trademarks of semiconductor co mponents industries, llc (scillc). scillc owns the rights to a numb er of patents, trademarks, copyrights, trade secrets, and other intellectual property. a list ing of scillc?s product/patent coverage may be accessed at ww w.onsemi.com/site/pdf/patent ? marking.pdf. scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and s pecifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. all operating parame ters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or a uthorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in whic h the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or us e scillc products for any such unintended or unauthorized appli cation, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unin tended or unauthorized use, even if such claim alleges that scil lc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyrig ht laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 mc74hc368a/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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